Global Patent Index - EP 0000591 B1

EP 0000591 B1 19801015 - APPARATUS TO FORM A SOLDERED JOINT BETWEEN OVERLAPPING ROOF-GUTTER SECTIONS

Title (en)

APPARATUS TO FORM A SOLDERED JOINT BETWEEN OVERLAPPING ROOF-GUTTER SECTIONS

Publication

EP 0000591 B1 19801015 (DE)

Application

EP 78200003 A 19780601

Priority

DE 2732370 A 19770718

Abstract (en)

[origin: EP0000591A1] 1. A soldering device for gutter sections in lapping relation wherein the soldering material especially a soldering strip is deposited between the lapping of the gutter sections comprising a pair of clamping jaws which clamping surfaces are shaped and proportioned appropriate to the profile of the gutter section from the beaded edge to the water groove to fit while being soldered snugly upon the faces of lapping gutter section by the inner clamping jaw hingedly connected at a clamping screw pivoted on a vertically adjustable clamp connected to the outer clamping jaw.

IPC 1-7

B23K 1/12

IPC 8 full level

B23K 1/00 (2006.01); B23K 3/08 (2006.01); E04D 13/068 (2006.01)

CPC (source: EP)

B23K 1/0008 (2013.01); B23K 3/087 (2013.01); E04D 13/068 (2013.01)

Designated contracting state (EPC)

BE CH DE FR GB LU NL SE

DOCDB simple family (publication)

EP 0000591 A1 19790207; EP 0000591 B1 19801015; DE 2732370 A1 19790201; DE 2732370 B2 19790531; DE 2732370 C3 19800110; DE 2860214 D1 19810122; DK 319278 A 19790119; IT 1097521 B 19850831; IT 7825772 A0 19780717

DOCDB simple family (application)

EP 78200003 A 19780601; DE 2732370 A 19770718; DE 2860214 T 19780601; DK 319278 A 19780717; IT 2577278 A 19780717