EP 0004449 B1 19811230 - BONDING PROCESS FOR GRINDING TOOLS
Title (en)
BONDING PROCESS FOR GRINDING TOOLS
Publication
Application
Priority
US 88808178 A 19780320
Abstract (en)
[origin: EP0004449A2] A bonding process for grinding tools in which a metallic workpiece (10) is pre-etched (14) to form cavities in the surface of the workpiece for individually receiving abrasive particles to be bonded thereto. The etched workpiece is at least partially embedded in a layer (46) of the abrasive particles in a first plating bath (20) comprising an aqueous solution of metal ions (22) and an electromotive force is imposed across the workpiece and an anode (34) so that the abrasive particles become partially embedded in the cavities in the workpiece surface as metal is plated on to the surface and around the abrasive particles adjacent to the surface. A second plating of metal in a second plating bath (40) securely bonds the particles to the workpiece and can provide the workpiece with a predetermined hardness for a particular application. The dual bonding process can be repeated for each layer to make multi-layered tools.
IPC 1-7
IPC 8 full level
B24D 3/06 (2006.01); B24D 18/00 (2006.01); C23F 1/00 (2006.01); C25D 15/00 (2006.01)
CPC (source: EP)
B24D 18/0018 (2013.01); C25D 15/00 (2013.01)
Designated contracting state (EPC)
BE CH DE FR GB IT LU NL SE
DOCDB simple family (publication)
EP 0004449 A2 19791003; EP 0004449 A3 19791114; EP 0004449 B1 19811230; AT 368053 B 19820910; AT A200579 A 19820115; CA 1143692 A 19830329; DE 2961643 D1 19820218; HK 92185 A 19851129; JP S54132892 A 19791016; JP S5921749 B2 19840522
DOCDB simple family (application)
EP 79300429 A 19790319; AT 200579 A 19790316; CA 322399 A 19790227; DE 2961643 T 19790319; HK 92185 A 19851121; JP 3008979 A 19790316