EP 0006939 B1 19820728 - POSITIVE TYPE RESIST POLYMER COMPOSITION AND METHOD OF MAKING RESIST PATTERNS
Title (en)
POSITIVE TYPE RESIST POLYMER COMPOSITION AND METHOD OF MAKING RESIST PATTERNS
Publication
Application
Priority
JP 13333677 A 19771107
Abstract (en)
[origin: JPS5466122A] PURPOSE:To enhance sensitivity, as well as heat resistance, contrast, resolution, etc., by using a specified copolymer for a positive tye resist material for use in ionizing raidation and ultraviolet lithography. CONSTITUTION:As functional monomers participating in cross-linking reaction, 2-20 mole % of methacrylamide and 0.4-20 mole % of methacryloyl chloride are selected and they are copolymerized with 70-97 mole %. This copolymer is dissolved in a solvent and coated on a substrate. Subsequent heating causes dehydrochlorination, imide type cross-linking, formation of 3-dimensional network structure, and insolubilization in solvents. Then, patterns are formed by irradiating ionizing radiation, and the part of patterns are dissolved selectively in a developing solvent.
IPC 1-7
IPC 8 full level
C08F 220/00 (2006.01); C08F 20/52 (2006.01); C08F 220/04 (2006.01); C08F 220/10 (2006.01); G03F 7/039 (2006.01); H01L 21/027 (2006.01)
CPC (source: EP US)
G03F 7/039 (2013.01 - EP US); Y10S 430/143 (2013.01 - EP)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0006939 A1 19800123; EP 0006939 A4 19800521; EP 0006939 B1 19820728; DE 2861975 D1 19820916; JP S5466122 A 19790528; JP S5624254 B2 19810604; US 4273856 A 19810616; WO 7900283 A1 19790531
DOCDB simple family (application)
EP 78900234 A 19790606; DE 2861975 T 19781106; JP 13333677 A 19771107; JP 7800021 W 19781106; US 11230979 A 19790702