EP 0018499 B1 19820630 - SELECTIVE ELECTROLESS PLATING PROCESS FOR THE SURFACES OF A WORKPIECE
Title (en)
SELECTIVE ELECTROLESS PLATING PROCESS FOR THE SURFACES OF A WORKPIECE
Publication
Application
Priority
US 3707379 A 19790508
Abstract (en)
[origin: US4239789A] A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 103 to 104. This enhancement is sufficient to make masking unnecessary.
IPC 1-7
IPC 8 full level
B23K 26/34 (2006.01); C23C 18/16 (2006.01); C23C 18/31 (2006.01); H05K 3/18 (2006.01); H05K 3/22 (2006.01)
CPC (source: EP US)
B23K 26/32 (2013.01 - EP US); B23K 26/324 (2013.01 - EP US); B23K 26/34 (2013.01 - EP US); C23C 18/161 (2013.01 - EP US); C23C 18/1612 (2013.01 - EP US); H05K 3/185 (2013.01 - EP US); B23K 2103/08 (2018.07 - EP US); B23K 2103/42 (2018.07 - EP US); B23K 2103/50 (2018.07 - EP US); B23K 2103/54 (2018.07 - EP US); Y02T 50/60 (2013.01 - US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0018499 A1 19801112; EP 0018499 B1 19820630; CA 1120656 A 19820330; DE 3060612 D1 19820819; JP S55148757 A 19801119; JP S5943987 B2 19841025; US 4239789 A 19801216
DOCDB simple family (application)
EP 80101624 A 19800327; CA 347870 A 19800318; DE 3060612 T 19800327; JP 2746680 A 19800306; US 3707379 A 19790508