EP 0025694 B1 19840328 - BRIGHT NICKEL PLATING BATH AND PROCESS AND COMPOSITION THEREFOR
Title (en)
BRIGHT NICKEL PLATING BATH AND PROCESS AND COMPOSITION THEREFOR
Publication
Application
Priority
US 7495379 A 19790913
Abstract (en)
[origin: EP0025694A1] Plating defects may occur during the electrodeposition of nickel using compositions containing primary and secondary brighteners. According to the invention such defects are avoided by including 0.01 to 1 g/l of a sulfonated acetylenic compound or a salt of such a compound in an aqueous acidic nickel plating bath containing 0.2 to 10 g/l of saccharin, and 20 to 500 parts per million of Zn ions. The acetylenic bond and the sulfonate radical of the sulfonated acetylenic compound are connected by a carbon chain of at least one carbon atom and not more than 6 carbon atoms. The invention relates to the composition of such a bath, to the method of bright nickel plating using such a bath and to compositions for forming the bath.
IPC 1-7
IPC 8 full level
C25D 3/12 (2006.01); C25D 3/16 (2006.01); C25D 3/18 (2006.01)
CPC (source: EP)
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI NL
DOCDB simple family (publication)
EP 0025694 A1 19810325; EP 0025694 B1 19840328; AT E6873 T1 19840415; AU 532948 B2 19831020; AU 6236580 A 19810319; BR 8005852 A 19810324; DE 3067275 D1 19840503; ES 495007 A0 19820601; ES 8205437 A1 19820601; HK 80384 A 19841102; JP S5647583 A 19810430; JP S6252035 B2 19871102; MX 153967 A 19870303; NZ 194923 A 19820525; ZA 805658 B 19820331
DOCDB simple family (application)
EP 80303183 A 19800910; AT 80303183 T 19800910; AU 6236580 A 19800912; BR 8005852 A 19800912; DE 3067275 T 19800910; ES 495007 A 19800912; HK 80384 A 19841025; JP 12661080 A 19800911; MX 18392180 A 19800912; NZ 19492380 A 19800911; ZA 805658 A 19800912