Global Patent Index - EP 0027520 B1

EP 0027520 B1 19830413 - ELECTRICAL WEAK-CURRENT CONTACT

Title (en)

ELECTRICAL WEAK-CURRENT CONTACT

Publication

EP 0027520 B1 19830413 (DE)

Application

EP 80105005 A 19800822

Priority

DE 2940772 A 19791008

Abstract (en)

[origin: US4339644A] A low-power electrical contact particularly suitable for switching and plug-in connections. The contact comprises an outer contact layer and a substrate composed of a copper base alloy. The contact layer consists essentially of an alloy of 35-55% by weight gold, 18-33.5% silver, 30-40% palladium, and (i) 1-6% indium, or (ii) 0.5-2% tin together with 0.5-2% indium. An intermediate layer of nickel or copper-nickel may be interposed between the contact layer and the substrate.

IPC 1-7

H01H 1/02; H01R 13/02; H01B 1/02

IPC 8 full level

C22C 5/02 (2006.01); C22C 5/04 (2006.01); C22C 9/00 (2006.01); C22C 9/02 (2006.01); C22C 30/00 (2006.01); H01H 1/02 (2006.01); H01H 1/023 (2006.01); H01H 1/025 (2006.01); H01H 1/04 (2006.01); H01R 13/03 (2006.01)

CPC (source: EP US)

H01H 1/023 (2013.01 - EP US); H01R 13/03 (2013.01 - EP US); Y10T 428/1259 (2015.01 - EP US); Y10T 428/12882 (2015.01 - EP US); Y10T 428/1291 (2015.01 - EP US); Y10T 428/31884 (2015.04 - EP US); Y10T 428/31895 (2015.04 - EP US)

Designated contracting state (EPC)

BE CH FR GB LI NL SE

DOCDB simple family (publication)

EP 0027520 A1 19810429; EP 0027520 B1 19830413; DE 2940772 A1 19810409; DE 2940772 C2 19820909; JP H0364969 B2 19911009; JP S5658939 A 19810522; US 4339644 A 19820713

DOCDB simple family (application)

EP 80105005 A 19800822; DE 2940772 A 19791008; JP 13999280 A 19801008; US 19317880 A 19801001