Global Patent Index - EP 0027603 A1

EP 0027603 A1 19810429 - Process for applying a photoresist, and photoresist solution.

Title (en)

Process for applying a photoresist, and photoresist solution.

Title (de)

Verfahren zum Anbringen eines Photoresistlacks und Photoresistlacklösung.

Title (fr)

Procédé d'application de photorésist et solution de photorésist.

Publication

EP 0027603 A1 19810429 (EN)

Application

EP 80106133 A 19801009

Priority

US 8722379 A 19791022

Abstract (en)

[origin: US4376815A] This invention is directed to processes for using a light sensitive photoresist material in the manufacture of an article having a surface permanently modified in an image pattern. The process comprises applying the photoresist to a substrate through a screen, preferably as a continuous, incompletely imaged layer and thereafter, imaging and developing to provide a relief image in the photoresist layer and treating the substrate to provide a permanent image in the finished article. The process is particularly useful in the manufacture of printed circuits. The process is believed to be a departure from conventional processes in the step of screening a light sensitive photoresist material over a substrate.

IPC 1-7

H05K 3/06

IPC 8 full level

G03C 1/74 (2006.01); G03F 7/16 (2006.01); H01L 21/027 (2006.01); H05K 3/06 (2006.01); H05K 3/28 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01)

CPC (source: EP US)

G03F 7/16 (2013.01 - EP US); H05K 3/28 (2013.01 - EP US); H05K 3/064 (2013.01 - EP US); H05K 3/108 (2013.01 - EP US); H05K 3/1216 (2013.01 - EP US); H05K 2203/0759 (2013.01 - EP US); Y10S 430/136 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

BE DE FR GB IT NL SE

DOCDB simple family (publication)

EP 0027603 A1 19810429; EP 0027603 B1 19840523; DE 3067957 D1 19840628; JP S5672438 A 19810616; US 4376815 A 19830315

DOCDB simple family (application)

EP 80106133 A 19801009; DE 3067957 T 19801009; JP 14808580 A 19801022; US 8722379 A 19791022