EP 0028387 B1 19840328 - TEMPERATURE SENSOR
Title (en)
TEMPERATURE SENSOR
Publication
Application
Priority
DE 2944015 A 19791031
Abstract (en)
[origin: EP0028387A1] 1. A temperature sensor consisting of a semiconductor body (1) which, on the one hand, is provided at its upper side with an insulating layer (2) in which there is arranged a window (5) through which the semiconductor body (1) is provided with a metal contact (3), and which, on the other hand, is provided on its surface facing away from the upper side with a metal coating (7), so that a spreading resistance is formed in the semiconductor body (1) between the metal contact (3) and the metal coating (7), characterised in that at least one further window (6) is additionally arranged on the upper side, through which window at least one further metal contact (4), which forms a further spreading resistance in the semiconductor body (1) with the metal coating (7), contacts the semiconductor body (1) ; that the thickness (d) of the semiconductor body (1) is substantially smaller than the distance (I) between the centre points of the windows (5, 6) ; and that the metal coating (7) serves as a connecting line between the spreading resistances in order to render the spreading resistance between the metal contacts (3, 4) and the metal coating (7) independent of the current direction or symmetrical.
IPC 1-7
IPC 8 full level
H01C 7/04 (2006.01); G01K 7/01 (2006.01); G01K 7/16 (2006.01); G01K 7/22 (2006.01); H01L 35/00 (2006.01)
CPC (source: EP)
G01K 7/01 (2013.01); G01K 7/223 (2013.01)
Designated contracting state (EPC)
FR GB NL
DOCDB simple family (publication)
EP 0028387 A1 19810513; EP 0028387 B1 19840328; DE 2944015 A1 19810514; DE 2944015 C2 19850110; JP H0159721 B2 19891219; JP S5679485 A 19810630
DOCDB simple family (application)
EP 80106607 A 19801028; DE 2944015 A 19791031; JP 15130080 A 19801028