EP 0032028 A2 19810715 - Method and apparatus for forming electrical interconnections.
Title (en)
Method and apparatus for forming electrical interconnections.
Title (de)
Verfahren und Apparat zur Formung elektrischer Leiterbahnen.
Title (fr)
Procédé et appareil pour former des interconnexions électriques.
Publication
Application
Priority
- JP 8424180 U 19800618
- JP 13074979 A 19791012
- JP 16410579 A 19791219
- JP 17480379 U 19791219
Abstract (en)
The formation of electrical interconnections on a semi-conductor substrate (2) provided with a number of semicoductor circuit elements, can be carried out by depositing an electrically conductive layer over substantially the entire surface of the semiconductor substrate (2) and then selectively etching the electrically conductive layer. The etching process involves wet chemical etching of the conductive layer in an etching solution (8). To enable accurate monitoring of the etching process, a connecting element (3) composed of the electrochemically same material as that of the electrically conductive layer is placed in contact with this layer and an electrode (5) composed of a material electrochemically different from the material of the conductive layer is disposed in the etching solution (8). Upon the substrate being dipped in the etching solution (8), an electrochemical cell is set up between the electrically conductive layer and the said electrode (5). An external circuit (6) is connected between the connecting element (3) and electrode (5); by monitoring the current flow produced in the external circuit (6) by the electrochemical cell, the progress of etching can be monitored. Apparatus is provided for effecting this monitoring method and this apparatus includes an electrode connector (4) for facilitating good electrical contact between the connecting element (3) and the substrate (2).
IPC 1-7
IPC 8 full level
C23F 1/00 (2006.01); G01N 17/02 (2006.01); H01L 21/3213 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01)
CPC (source: EP US)
B24B 37/013 (2013.01 - EP US); C23F 1/00 (2013.01 - EP US); G01N 17/02 (2013.01 - EP US); H01L 21/32134 (2013.01 - EP US); H01L 21/76838 (2013.01 - EP US); H01L 22/26 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0032028 A2 19810715; EP 0032028 A3 19820120; EP 0032028 B1 19850821; US 4338157 A 19820706
DOCDB simple family (application)
EP 80304609 A 19801219; US 18543980 A 19800909