EP 0035529 A1 19810916 - DEVICE MANUFACTURE INVOLVING PATTERN DELINEATION IN THIN LAYERS.
Title (en)
DEVICE MANUFACTURE INVOLVING PATTERN DELINEATION IN THIN LAYERS.
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER ANORDNUNG UNTER VERWENDUNG VON STREIFENMUSTERN IN DÜNNSCHICHTEN.
Title (fr)
FABRICATION D'UN DISPOSITIF COMPORTANT UNE TRACE DE MODELES DANS DES COUCHES FINES.
Publication
Application
Priority
US 7140879 A 19790830
Abstract (en)
[origin: WO8100646A1] Etch procedures are monitored electrically by initiation of current flow upon baring of conducting surface (19) to etching fluid (11). Procedures include photoresist development in which current flow is through the usual aqueous ionic developing solution. In an exemplary use, a specifically designed monitoring wafer (10) serves for detection of end point for a batch of wafers undergoing processing.
Abstract (fr)
Des procedes de gravure sont controles electriquement par l'initiation d'un flux de courant sur la partie mise a nu d'une surface conductrice (19) exposee au fluide de gravure chimique (11). Les procedes comprennent ce developpement d'une photo reserve, dans lequel le flux de courant se produit a travers la solution aqueuse habituelle de developpement ionique. Dans une utilisation typique, une gaufrette de controle specifiquement concue (10) sert a detecter le point final pour un lot de gaufrettes en traitement.
IPC 1-7
IPC 8 full level
H01L 21/306 (2006.01); G01N 17/02 (2006.01); G01R 31/302 (2006.01); G03F 7/30 (2006.01); H01L 21/311 (2006.01); H01L 21/66 (2006.01)
CPC (source: EP)
B24B 37/013 (2013.01); G01N 17/02 (2013.01); G01R 31/302 (2013.01); G03F 7/30 (2013.01); H01L 21/31133 (2013.01); H01L 22/26 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 8100646 A1 19810305; EP 0035529 A1 19810916; EP 0035529 A4 19820216; JP S56501226 A 19810827
DOCDB simple family (application)
US 8000934 W 19800728; EP 80901737 A 19810309; JP 50204080 A 19800728