EP 0043485 B1 19850515 - METHOD OF ACTIVATING SURFACES FOR ELECTROLESS PLATING
Title (en)
METHOD OF ACTIVATING SURFACES FOR ELECTROLESS PLATING
Publication
Application
Priority
DE 3025307 A 19800704
Abstract (en)
[origin: EP0043485A1] 1. Process for activating metallic and non-metallic surfaces for the purpose of currentless metal deposition, characterized in that a) the surface to be metallized is wetted with an organometallic compound from the series comprising butadiene palladium dichloride, diacetonitrile palladium dichloride, diacetonitrile platinum dichloride and dibenzonitrile palladium dichloride, which compound is stable towards air and moisture and is dispersed in an organic solvent, b) the organic solvent is removed and c) the organometallic compound adhering to the surface to be metallized is reduced.
IPC 1-7
IPC 8 full level
C23C 18/18 (2006.01); C23C 18/28 (2006.01); C23C 18/30 (2006.01)
CPC (source: EP)
C23C 18/30 (2013.01)
Citation (examination)
- The Organic Chemistry of Palladium (1971), Vol. I, Seite 137
- Chemistry of Coordination Compounds (1956), J.C. Bailar, Abschnitt 15, Seiten 487-508
- Comprehensive Inorganic Chemistry (1975), Band 3, Seite 1323
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
EP 0043485 A1 19820113; EP 0043485 B1 19850515; AT E13319 T1 19850615; CA 1169720 A 19840626; DE 3025307 A1 19820128; DE 3170482 D1 19850620; ES 503645 A0 19820601; ES 8205269 A1 19820601; JP S5743977 A 19820312; JP S6354791 B2 19881031
DOCDB simple family (application)
EP 81104782 A 19810622; AT 81104782 T 19810622; CA 380974 A 19810702; DE 3025307 A 19800704; DE 3170482 T 19810622; ES 503645 A 19810703; JP 10347481 A 19810703