EP 0050657 A4 19820903 - TEMPERATURE-STABLE MICROWAVE INTEGRATED CIRCUIT DELAY LINE.
Title (en)
TEMPERATURE-STABLE MICROWAVE INTEGRATED CIRCUIT DELAY LINE.
Title (de)
TEMPERATURSTABILISIERTE INTEGRIERTE MIKROWELLENVERZÖGERUNGSLEITUNG.
Title (fr)
LIGNE DE TEMPORISATION A CIRCUIT INTEGRE A MICRO-ONDES AYANT UNE TEMPERATURE STABLE.
Publication
Application
Priority
US 14368280 A 19800425
Abstract (en)
[origin: WO8103087A1] A temperature-stable microwave integrated circuit (MIC) delay line (10) employs at least two cascade connected dielectric substrates (12, 14), for example, a high dielectric barium tetratitanate (Ba- Ti<u4>u0<u9>u) ceramic microstrip (22), and a short sapphire single crystal Al<u2>u0<u3>u microstrip section (26). Temperature changes in the transmission phase are compensated for by selecting the substrate materials such that the positive transmission phase temperature coefficient of one substrate is effectively cancelled out by the negative transmission phase temperature coefficient of the other sub-strate. In this manner, the transmission delay temperature coefficient of the composite delay line may be reduced to a value of 0.6(+/- 0.3) x 10- 6 parts per degree C. at 14 GHz over the temperature range of 20 degrees C. +/- 30 degrees C.
IPC 1-7
IPC 8 full level
H01P 1/30 (2006.01); H01P 3/08 (2006.01); H01P 9/00 (2006.01)
CPC (source: EP)
H01P 1/30 (2013.01); H01P 9/006 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 8103087 A1 19811029; EP 0050657 A1 19820505; EP 0050657 A4 19820903; JP S57500538 A 19820325
DOCDB simple family (application)
US 8100543 W 19810427; EP 81901261 A 19810427; JP 50163881 A 19810427