Title (en)

HEAT TRANSFER BOILING SURFACE

Publication

EP 0057941 A3 19821208 (EN)

Application

EP 82100978 A 19820210

Priority

US 23351781 A 19810211

Abstract (en)

[origin: EP0057941A2] A heat transfer device comprises a base wall of heat conductive material, a plurality of spaced apart fins formed integrally with the surface of the base wall at 30 to 40 fins per inch, and a plurality of indentations formed in the peripheral edge of the fins by a diamond knurling tool forming two series of parallel threads in the range of 40-80 threads per inch intersecting each other at an angle of 10 to 80 degrees.

IPC 1-7

F28F 13/18; F28F 1/12

IPC 8 full level

F28F 13/14 (2006.01); F28F 1/12 (2006.01); F28F 13/02 (2006.01); F28F 13/18 (2006.01)

CPC (source: EP)

F28F 1/12 (2013.01); F28F 13/187 (2013.01)

Citation (search report)

• [X] US 4040479 A 19770809 - CAMPBELL BONNIE J, et al
• [A] US 3602027 A 19710831 - KLUG WILLIAM A, et al
• [A] DE 2043459 A1 19720309 - BATTELLE INSTITUT E V
• [A] US 3850227 A 19741126 - FORD J
• [A] US 3768290 A 19731030 - ZATELL V
• [A] GB 2013325 A 19790808 - WIELAND WERKE AG
• [A] US 3765192 A 19731016 - ROOT D
• [A] FR 1493922 A 19670901 - EURATOM, et al
• [A] US 3893322 A 19750708 - CAMPBELL BONNIE J, et al

Designated contracting state (EPC)

BE CH DE FR GB IT LI LU NL SE

DOCDB simple family (publication)

EP 0057941 A2 19820818; EP 0057941 A3 19821208; AU 7914681 A 19820819; CA 1155107 A 19831011; IL 64578 A0 19820331; JP S57139294 A 19820828; NO 820103 L 19820812

DOCDB simple family (application)

EP 82100978 A 19820210; AU 7914681 A 19811231; CA 392151 A 19811211; IL 6457881 A 19811218; JP 83382 A 19820106; NO 820103 A 19820114