EP 0059787 A1 19820915 - Apparatus for the partial electroplating of electrically conductive tapes, strips or suchlike bundled parts in a continuous process.
Title (en)
Apparatus for the partial electroplating of electrically conductive tapes, strips or suchlike bundled parts in a continuous process.
Title (de)
Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefassten Teilen im Durchlaufverfahren.
Title (fr)
Appareil pour couvrir d'une couche mince des pièces électroconductrices composées de bandes, de rubans ou analogues pour un procédé éléctrolytrique en continu.
Publication
Application
Priority
DE 3108358 A 19810305
Abstract (en)
[origin: US4427520A] A device for electroplating portions of a continuously moving, cathodically connecting workpiece as it is moved past a plurality of anodically connected spray nozzles characterized by the spray nozzles comprising precious metal and being positioned one after another in a row along the direction of movement of the workpiece with each of the nozzles having an individual stream of electrolytes emerging unimpeded therefrom. The continuously moving workpiece is positioned so that selected portions thereof are moved along the row of nozzles to be contacted by the stream of electrolyte emerging from the individual nozzles for a free and unimpeded electroplating of the portions contacted by the streams.
Abstract (de)
Vorrichtung zum partiellen Galvanisieren von zu leitenden Bändern oder dgl. zusammengefaßten Teilen im Durchlaufverfahren, wobei das kathodisch geschaltete Band (2) an einer Mehrzahl von anodisch geschalteten Sprühdüsen (7) aus Edelmetall entlanggeführt wird, welche in Bewegungsrichtung des Bandes (2) gesehen hintereinander derart angeordnet und gegen das Band (2) gerichtet sind, daß der aus jeder einzelnen Sprühdüse (7) austretende Elektrolytstrahl frei und unbehindert auf den zu galvanisierenden Bereich auf dem Band (2) trifft.
IPC 1-7
IPC 8 full level
B05B 5/00 (2006.01); B05B 5/08 (2006.01); C25D 5/02 (2006.01); C25D 5/08 (2006.01)
CPC (source: EP US)
B05B 5/08 (2013.01 - EP US); C25D 5/02 (2013.01 - EP US); C25D 5/08 (2013.01 - EP US)
Citation (search report)
- CH 621825 A5 19810227 - ELECTROPLATING ENG [JP]
- US 4240880 A 19801223 - KOBAYASHI TAKASHI [JP], et al
- DE 2551988 A1 19770526 - SCHERING AG
- DE 2620995 B2 19790913
- DE 2644970 A1 19770414 - NAT SEMICONDUCTOR CORP
Designated contracting state (EPC)
AT BE CH DE FR GB IT LU NL SE
DOCDB simple family (publication)
EP 0059787 A1 19820915; EP 0059787 B1 19870624; AT E27974 T1 19870715; DE 3108358 A1 19820916; DE 3108358 C2 19850829; DE 3176278 D1 19870730; JP H024678 B2 19900130; JP S57161084 A 19821004; US 4427520 A 19840124
DOCDB simple family (application)
EP 81108594 A 19811020; AT 81108594 T 19811020; DE 3108358 A 19810305; DE 3176278 T 19811020; JP 3373482 A 19820303; US 34406082 A 19820129