Global Patent Index - EP 0063925 A1

EP 0063925 A1 19821103 - Electro-plating process and products therefrom.

Title (en)

Electro-plating process and products therefrom.

Title (de)

Verfahren zur elektrolytischen Plattierung und dadurch hergestellte Produkte.

Title (fr)

Procédé d'électro-déposition et produits ainsi obtenus.

Publication

EP 0063925 A1 19821103 (EN)

Application

EP 82302060 A 19820422

Priority

GB 8112666 A 19810424

Abstract (en)

A process for electro-plating a selected surface area of an electrical connector contact element (2), e.g. of copper alloy, comprising electro-plating the connector in the absence of a masking (1) element to give the required thickness of plating material in the selected area, (3) applying a masking element, such as a pin or sheath, to the selected area of the connector where the plating material is to be retained, and stripping the plating material from the unmasked parts of the connector so that the connector remains plated in the selected area only. The process is especially applicable to connectors suitable for use in the assembly of computers.

IPC 1-7

C25D 5/02

IPC 8 full level

C25D 5/02 (2006.01)

CPC (source: EP)

C25D 5/02 (2013.01)

Citation (search report)

Designated contracting state (EPC)

BE CH DE FR IT NL SE

DOCDB simple family (publication)

EP 0063925 A1 19821103; GB 2097426 A 19821103; GB 2097426 B 19840118

DOCDB simple family (application)

EP 82302060 A 19820422; GB 8112666 A 19810424