EP 0066347 B1 19870415 - ELECTROLYTIC BATH FOR THE DEPOSITION AND PENETRATION OF METALLIC COATINGS ON METALLIC SUBSTRATES
Title (en)
ELECTROLYTIC BATH FOR THE DEPOSITION AND PENETRATION OF METALLIC COATINGS ON METALLIC SUBSTRATES
Publication
Application
Priority
- US 22476281 A 19810113
- US 31967281 A 19811109
- US 33528281 A 19811228
Abstract (en)
[origin: EP0066347A1] A solution for the fusion of a second metal to a first metal is provided which comprises 0.10 to 10% of the second metal in a dissociable form; and a solvent chosen from water, an organic solvent or a mixture thereof, the solution having a conductivity in the range 10 to 80 ohms cm.
IPC 1-7
IPC 8 full level
C25D 5/18 (2006.01); C25D 17/14 (2006.01)
CPC (source: EP KR US)
C25D 3/02 (2013.01 - KR); C25D 5/18 (2013.01 - EP US); C25D 5/605 (2020.08 - EP US); C25D 5/623 (2020.08 - EP US); C25D 5/627 (2020.08 - EP US); C25D 17/14 (2013.01 - EP US); C25D 5/18 (2013.01 - KR); C25D 5/605 (2020.08 - KR); C25D 5/623 (2020.08 - KR); C25D 5/627 (2020.08 - KR); Y10S 204/09 (2013.01 - KR)
Citation (examination)
Kuhn: Industrial Electrochemical Processes N.Y. (1971) Elseres Publ. p. 354/55
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
EP 0066347 A1 19821208; EP 0066347 B1 19870415; AU 7944982 A 19820722; DD 202313 A5 19830907; DE 3276074 D1 19870521; DK 11182 A 19820714; FI 820081 L 19820714; KR 830009258 A 19831219; NO 820076 L 19820714
DOCDB simple family (application)
EP 82300140 A 19820112; AU 7944982 A 19820112; DD 23671282 A 19820113; DE 3276074 T 19820112; DK 11182 A 19820113; FI 820081 A 19820111; KR 820000120 A 19820113; NO 820076 A 19820112