Global Patent Index - EP 0070435 B1

EP 0070435 B1 1988-01-07 - SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR SUBSTRATE BONDED TO A MOUNTING MEANS

Title (en)

SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR SUBSTRATE BONDED TO A MOUNTING MEANS

Publication

EP 0070435 B1 (EN)

Application

EP 82105893 A

Priority

JP 10415981 A

Abstract (en)

[origin: US4480261A] In bonding a semiconductor substrate onto a mounting means, a multiple layer metal electrode is formed on the surface, the multiple layer comprising at least a chromium-nickel alloy layer, nickel layer and a noble metal layer of a noble metal selected from a group consisting of gold, silver or platinum, which is bonded to a solder layer of Pb-Sn-alloy or Ag-Sb-Sn-alloy of the mounting means.

IPC 1-7

H01L 23/48; H01L 21/60

IPC 8 full level

H01L 21/52 (2006.01); H01L 21/58 (2006.01); H01L 21/60 (2006.01); H01L 23/492 (2006.01)

CPC

H01L 24/83 (2013.01); H01L 23/4924 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/8319 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/8385 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/014 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/15738 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/1576 (2013.01)

C-Set

  1. H01L 2224/29101 + H01L 2924/014 + H01L 2924/00
  2. H01L 2924/0132 + H01L 2924/01024 + H01L 2924/01028
  3. H01L 2924/0132 + H01L 2924/01026 + H01L 2924/01028
  4. H01L 2924/0132 + H01L 2924/01028 + H01L 2924/0105
  5. H01L 2924/0133 + H01L 2924/01047 + H01L 2924/0105 + H01L 2924/01051
  6. H01L 2924/0132 + H01L 2924/0105 + H01L 2924/01082
  7. H01L 2224/29116 + H01L 2924/0105 + H01L 2924/00012
  8. H01L 2224/29111 + H01L 2924/01047 + H01L 2924/01051 + H01L 2924/00012
  9. H01L 2924/15738 + H01L 2924/01028

DCS

DE FR GB

DOCDB simple family

US 4480261 A 19841030; CA 1189984 A 19850702; DE 3277953 D1 19880211; EP 0070435 A2 19830126; EP 0070435 A3 19841121; EP 0070435 B1 19880107; JP H0145220 B2 19891003; JP S586143 A 19830113