EP 0071244 A3 19850515 - THIN-FILM TRANSISTOR AND METHOD OF MANUFACTURE THEREFOR
Title (en)
THIN-FILM TRANSISTOR AND METHOD OF MANUFACTURE THEREFOR
Publication
Application
Priority
- JP 5142182 A 19820331
- JP 11742381 A 19810727
Abstract (en)
[origin: EP0071244A2] A method for manufacturing thin-film transistor (74) comprises steps of sequentially forming in laminar state a gate film (42), an insulating film (44) and a conductive film having a transparent electrode film (60) and an amorphous silicon film (62) added with an impurity thereto on the top surface of glass substrate or layer (40); irradiating ultraviolet ray (50) from the bottom surface side of the substrate (40) to expose negative photoresist film (64) on said conductive film (60, 62) and to etch the same; and forming an amorphous semiconductive film (72) on the structure. In this manner, source and drain electrodes (68, 70) are respectively self-aligned with the gate electrode (42) and contacted therewith through a semiconductive film (72) and a low resistive and semiconductive film (62a).
IPC 1-7
IPC 8 full level
H01L 21/336 (2006.01); H01L 29/786 (2006.01)
CPC (source: EP US)
H01L 29/66765 (2013.01 - EP US); H01L 29/78669 (2013.01 - EP US); H01L 29/78678 (2013.01 - EP US); H01L 29/78681 (2013.01 - EP US); H01L 29/78684 (2013.01 - EP US); Y10S 148/106 (2013.01 - EP US); Y10S 438/949 (2013.01 - EP US)
Citation (search report)
- [A] DE 1489162 A1 19690612 - PHILIPS NV
- [A] THIN SOLID FILMS, vol. 61, no. 2, August 1979, pages 259-264, Elsevier Sequoia S.A., Lausanne, CH; T. KALLFASS et al.: "High voltage thin film transistors manufactured with photolithography and with Ta2O5 as the gate oxide"
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0071244 A2 19830209; EP 0071244 A3 19850515; EP 0071244 B1 19881123; DE 3279239 D1 19881229; US 4700458 A 19871020
DOCDB simple family (application)
EP 82106781 A 19820727; DE 3279239 T 19820727; US 77964885 A 19850924