EP 0071512 B1 19850605 - PROCESS FOR THE PREPARATION OF AN ADDITIVE FOR AN ACID BATH FOR THE ELECTRODEPOSITION OF COPPER AND USE THEREOF
Title (en)
PROCESS FOR THE PREPARATION OF AN ADDITIVE FOR AN ACID BATH FOR THE ELECTRODEPOSITION OF COPPER AND USE THEREOF
Publication
Application
Priority
FR 8114394 A 19810724
Abstract (en)
[origin: US4430173A] Additive composition for an acid copper electroplating bath, which bath being well adapted for the copper plating of printed circuits, is comprised of (1) the sodium salt of omega -sulfo-n-propyl N,N-diethyldithiocarbamate, (2) polyethylene glycol having an average molecular weight ranging from about 6,000 to 20,000, (3) crystal violet, and (4) sulfuric acid.
IPC 1-7
IPC 8 full level
H05K 3/18 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01)
CPC (source: EP US)
C25D 3/38 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
EP 0071512 A1 19830209; EP 0071512 B1 19850605; AT E13697 T1 19850615; DE 3264038 D1 19850711; FR 2510145 A1 19830128; FR 2510145 B1 19860207; HK 96586 A 19861219; IE 53352 B1 19881026; IE 821754 L 19830124; JP S5827992 A 19830218; JP S6155599 B2 19861128; SG 64086 G 19870918; US 4430173 A 19840207
DOCDB simple family (application)
EP 82401328 A 19820716; AT 82401328 T 19820716; DE 3264038 T 19820716; FR 8114394 A 19810724; HK 96586 A 19861211; IE 175482 A 19820722; JP 12684882 A 19820722; SG 64086 A 19860724; US 39880582 A 19820716