Global Patent Index - EP 0073191 A1

EP 0073191 A1 19830309 - HEAT STABLE MOLDED PHENOLIC RESIN ARTICLE.

Title (en)

HEAT STABLE MOLDED PHENOLIC RESIN ARTICLE.

Title (de)

HITZEBESTÄNDIGER GEFORMTER GEGENSTAND AUS PHENOLHARZ.

Title (fr)

ARTICLE EN RESINE PHENOLIQUE MOULEE STABLE A LA CHALEUR.

Publication

EP 0073191 A1 19830309 (EN)

Application

EP 81901736 A 19810302

Priority

US 8100253 W 19810302

Abstract (en)

[origin: WO8203080A1] A heat stable molded phenolic resin article comprising, in percent by weight, from about 20 to about 70 percent of a phenolic resin, from about 3 to about 25 percent of an acrylonitrilebutadiene elastomer, and from about 15 to about 70 percent of a silicate mineral. Also a molding composition comprising, in percent by weight, from about 20 to about 70 weight percent of a phenol-aldehyde thermosettable resin, from about 3 to about 25 weight percent of an acrylonitrilebutadiene elastomer, and from about 15 to about 70 weight percent of silicate mineral.

Abstract (fr)

Article en resine phenolique moulee stable a la chaleur comprenant, en pourcentages ponderaux. environ 20 a 70% d'une resine phenolique, environ 3 a 25% d'un elastomere d'acrylonitrile butadiene et environ 15 a 70% d, un silicate mineral. Composition de moulage comprenant, en pourcentages ponderaux, environ 20 a 70% en poids d'une resine thermodurcissable de phenol-aldehyde, environ 3 a 25% en poids d'un elastomere d'acrylonitrile butadiene, et environ 15 a 70% en poids d'un silicate mineral.

IPC 1-7

C08L 61/06

IPC 8 full level

C04B 26/12 (2006.01); C08K 3/34 (2006.01); C08L 33/20 (2006.01); C08L 61/06 (2006.01)

CPC (source: EP)

C04B 26/122 (2013.01); C08K 3/34 (2013.01); C08L 33/20 (2013.01); C08L 61/06 (2013.01)

C-Set (source: EP)

  1. C04B 26/122 + C04B 14/04 + C04B 14/22 + C04B 20/1051 + C04B 24/26
  2. C08K 3/34 + C08L 61/06
  3. C08L 33/20 + C08L 2666/14
  4. C08L 61/06 + C08L 2666/08

Designated contracting state (EPC)

AT DE FR GB NL

DOCDB simple family (publication)

WO 8203080 A1 19820916; BR 8108979 A 19830125; EP 0073191 A1 19830309; EP 0073191 A4 19830823; JP S58500568 A 19830414

DOCDB simple family (application)

US 8100253 W 19810302; BR 8108979 A 19810302; EP 81901736 A 19810302; JP 50217881 A 19810302