Global Patent Index - EP 0073236 A1

EP 0073236 A1 19830309 - PALLADIUM AND PALLADIUM ALLOYS ELECTROPLATING PROCEDURE.

Title (en)

PALLADIUM AND PALLADIUM ALLOYS ELECTROPLATING PROCEDURE.

Title (de)

ELEKTROPLATTIERUNGSVERFAHREN FÜR PALLADIUM UND PALLADIUMLEGIERUNGEN.

Title (fr)

PROCEDE DE REVETEMENT PAR ELECTRODEPOSITION DE PALLADIUM ET DES ALLIAGES DE PALLADIUM.

Publication

EP 0073236 A1 19830309 (EN)

Application

EP 82901061 A 19820218

Priority

US 23915181 A 19810227

Abstract (en)

[origin: EP0059452A2] A procedure for electroplating palladium and palladium alloys is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique complex of palladium and aliphatic polyamine the latter having from 3 to 20 carbon atoms and may have at least one substituent selected from hydrogen, hydroxide, chloride and bromide. The bath is highly stable and does not adversely affect the base material being plated.

Abstract (fr)

Procede de revetement par electrodeposition d'alliages de palladium permettant un placage rapide et efficace et produisant des pellicules de palladium ductiles et adherentes. Le bain de revetement (13) comprend un complexe unique de palladium et d'une polyamine aliphatique, cette derniere possedant de 3 a 20 atomes de carbone et pouvant avoir au moins un substituant selectionne entre l'hydrogene, un hydroxyde, un chlorure et un bromure. Le bain est tres stable et n'agit pas negativement sur le materiau de base (11) soumis au placage.

IPC 1-7

C25D 3/52; C25D 3/56; C25D 3/58

IPC 8 full level

C25D 3/50 (2006.01); C25D 3/52 (2006.01); C25D 3/56 (2006.01); C25D 3/58 (2006.01); C25D 3/64 (2006.01)

CPC (source: EP)

C25D 3/52 (2013.01)

Designated contracting state (EPC)

BE CH DE FR LI NL SE

DOCDB simple family (publication)

EP 0059452 A2 19820908; EP 0059452 A3 19821110; EP 0059452 B1 19851009; CA 1189016 A 19850618; DE 3266736 D1 19851114; EP 0073236 A1 19830309; EP 0073236 A4 19830114; EP 0073236 B1 19851009; GB 2112018 A 19830713; GB 2112018 B 19840815; HK 48088 A 19880708; JP H0219197 B2 19900427; JP S58500289 A 19830224; WO 8202908 A1 19820902

DOCDB simple family (application)

EP 82101494 A 19820226; CA 397244 A 19820226; DE 3266736 T 19820218; EP 82901061 A 19820218; GB 8230414 A 19820218; HK 48088 A 19880630; JP 50116582 A 19820218; US 8200200 W 19820218