Global Patent Index - EP 0077070 B1

EP 0077070 B1 19850130 - METHOD OF AND APPARATUS FOR SETTING UP LEVELLED COLUMN ELEMENTS OF A DOUBLE FLOOR

Title (en)

METHOD OF AND APPARATUS FOR SETTING UP LEVELLED COLUMN ELEMENTS OF A DOUBLE FLOOR

Publication

EP 0077070 B1 19850130 (DE)

Application

EP 82109426 A 19821012

Priority

DE 3140574 A 19811013

Abstract (en)

[origin: EP0077070A1] 1. Method of setting base elements (11), levelled in respect of height, of a double floor by adhesive bonding to the underfloor (10) and subsequent levelling of the upper sides of the base elements (11), characterised in that ready-made billets (24) of a dimensionally stable material that is capable of being separated are bonded in an upright position to the underfloor (10) and then cut to length at the desired height.

IPC 1-7

E04F 15/024; E04B 1/36

IPC 8 full level

E04B 1/36 (2006.01); E04D 15/04 (2006.01); E04F 15/024 (2006.01)

CPC (source: EP)

E04D 15/04 (2013.01); E04F 15/024 (2013.01)

Citation (examination)

DE 2214382 A1 19731011 - BAYER AG

Designated contracting state (EPC)

AT BE CH DE FR GB IT LI LU NL SE

DOCDB simple family (publication)

EP 0077070 A1 19830420; EP 0077070 B1 19850130; AT E11584 T1 19850215; DE 3140574 A1 19830609; DE 3262160 D1 19850314

DOCDB simple family (application)

EP 82109426 A 19821012; AT 82109426 T 19821012; DE 3140574 A 19811013; DE 3262160 T 19821012