Global Patent Index - EP 0105254 A4

EP 0105254 A4 19840810 - IMPROVED FERRITE CORE ASSEMBLY AND MOUNTING MEANS.

Title (en)

IMPROVED FERRITE CORE ASSEMBLY AND MOUNTING MEANS.

Title (de)

VERBESSERTER ZUSAMMENBAU UND MONTAGEVORRICHTUNG FÜR FERRITKERNE.

Title (fr)

ASSEMBLAGE ET MOYENS DE MONTAGE AMELIORES DE NOYAUX DE FERRITE.

Publication

EP 0105254 A4 19840810 (EN)

Application

EP 82901455 A 19820329

Priority

US 8200396 W 19820329

Abstract (en)

[origin: WO8303495A1] Inductance of a coil can be influenced both by improper contact between the core elements and by relative rotation of the core elements which tends to misalign mating outer wall portions. The present invention prevents misalignment of the cores and provides an improved core and coil arrangement which is easily assembled and can be properly mounted on a circuit board. The improved assembly (10) includes a pair of ferrite core elements (12, 14) adapted to receive a coil (16) wound on a bobbin (18) and to be assembled and held in precisely aligned, abutting relation by a combination spring clip and mounting member (20). The core elements each have a pair of shallow relatively wide recesses which, when assembled, cooperate to define a pair of aligning grooves extending in substantially perpendicular relationship to mating surfaces of the core parts along the full length of the assembly on opposite sides thereof. The unitary spring clip and mounting member (20) includes a resilient portion (52) adapted to engage one core element (12), a pair of substantially straight legs (54, 56) adapted to extend along and fit closely one within each of the aligning grooves in the core assembly (10), and an inwardly directed flange (58, 60) on each leg adapted to fit over and engage the remaining core element (14) to firmly clamp the two core elements in abutting relationship. Elongated mounting posts (62, 64, 66, 68) can be integrally formed on the legs, and a stand-off lug (70, 72, 74, 76) can be integrally formed on each mounting post to facilitate mounting the assembly on a support structure such as a printed circuit board.

IPC 1-7

H01F 15/02; H01F 27/26

IPC 8 full level

H01F 27/06 (2006.01); H01F 17/04 (2006.01); H01F 27/02 (2006.01)

CPC (source: EP)

H01F 17/041 (2013.01); H01F 17/043 (2013.01); H01F 27/027 (2013.01)

Citation (search report)

[A] US 4283699 A 19810811 - EHRGOTT ROLAND, et al

Designated contracting state (EPC)

DE FR GB NL SE

DOCDB simple family (publication)

WO 8303495 A1 19831013; EP 0105254 A1 19840418; EP 0105254 A4 19840810; JP S59500538 A 19840329

DOCDB simple family (application)

US 8200396 W 19820329; EP 82901455 A 19820329; JP 50148882 A 19820329