EP 0107109 A3 19840725 - ELECTROLYTIC COPPER PLATING SOLUTIONS AND A METHOD FOR THEIR APPLICATION
Title (en)
ELECTROLYTIC COPPER PLATING SOLUTIONS AND A METHOD FOR THEIR APPLICATION
Publication
Application
Priority
US 42905582 A 19820930
Abstract (en)
[origin: EP0107109A2] Acid copper electroplating solutions containing the reaction product of (1) a compound of the formula <CHEM> wherein R1 and R2 are lower alkyl radicals of with 1 to 6 carbon atoms, a hydrogen atom or mixtures thereof and R4 is an alkali metal, hydrogen, magnesium, or the groups SX or SSX, wherein X is an alkali metal, hydrogen or magnesium, or a compound of the formula <CHEM> wherein R3 is an aromatic, heterocyclic or alicyclic radical containing 3 to 12 carbon atoms and R4 is an alkali metal, hydrogen, magnesium, or the groups SX or SSX where X is an alkali metal, hydrogen or magnesium, (2) a compound of the formula XR1-(S)n-R2-SO3H wherein R1 and R2 are the same or different and are alkylene radicals containing 1 to 6 carbon atoms, X is hydrogen or -SO3H and n equals 2 to 5, and (3) acrylamide in a sufficient amount to increase the brightness of the deposit and/or to prevent the formation of cracks during thermal shock.
IPC 1-7
IPC 8 full level
C07G 17/00 (2006.01); C07G 99/00 (2009.01); C25B 11/06 (2006.01); C25D 3/38 (2006.01)
CPC (source: EP)
C25D 3/38 (2013.01)
Citation (search report)
- [AD] US 3328273 A 19670627 - HANS-GERHARD CRENTZ, et al
- [A] FR 2406009 A1 19790511 - SCHERING AG [DE]
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI LU NL SE
DOCDB simple family (publication)
EP 0107109 A2 19840502; EP 0107109 A3 19840725; EP 0107109 B1 19880224; AT E32611 T1 19880315; DE 107109 T1 19850214; DE 3375732 D1 19880331; JP S59501829 A 19841101; JP S6250559 B2 19871026; WO 8401393 A1 19840412
DOCDB simple family (application)
EP 83109814 A 19830930; AT 83109814 T 19830930; DE 3375732 T 19830930; DE 83109814 T 19830930; JP 50335183 A 19830928; US 8301508 W 19830928