EP 0111404 A2 19840620 - Method and apparatus for inspecting plated through holes in printed circuit boards.
Title (en)
Method and apparatus for inspecting plated through holes in printed circuit boards.
Title (de)
Verfahren und Apparat zur Untersuchung von plattierten Bohrungen in einer Platte von gedruckten Schaltungen.
Title (fr)
Méthode et appareil pour l'inspection de perçages métallisés dans une plaquette de circuit imprimé.
Publication
Application
Priority
- JP 1139483 A 19830128
- JP 1139583 A 19830128
- JP 1139683 A 19830128
- JP 21011082 A 19821130
- JP 22836982 A 19821227
- JP 22837582 A 19821227
- JP 22837682 A 19821227
- JP 22867282 A 19821228
- JP 22867382 A 19821228
- JP 22867682 A 19821228
Abstract (en)
To inspect plated through holes (4) in a printed circuit board (1), light (6) from a light source is shone on the board. Light enters the through holes and also the light-transmitting substrate (2) of the printed circuit board. A light detector (8) senses light from the holes and the signal from the light detector indicates the location of the holes. <??>A located hole (4) is masked to prevent light shining on the board from directly entering the hole. The only light which now enters the hole, leaks from the substrate through defects (3a) in the plating (3). A light detector (8) senses light from the hole, and the signal from the light detector indicates the presence of defects, if any, in the plating of the through hole. <??>Hence by signals supplied from light detectors, plated through holes can be continuously and efficiently inspected.
IPC 1-7
IPC 8 full level
G01N 21/956 (2006.01)
CPC (source: EP US)
G01N 21/95692 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
EP 0111404 A2 19840620; EP 0111404 A3 19850116; EP 0111404 B1 19880727; DE 3377527 D1 19880901; US 4560273 A 19851224
DOCDB simple family (application)
EP 83307291 A 19831130; DE 3377527 T 19831130; US 55454383 A 19831123