Global Patent Index - EP 0121467 B1

EP 0121467 B1 19870805 - MICROCONNECTOR WITH A HIGH CONTACT DENSITY

Title (en)

MICROCONNECTOR WITH A HIGH CONTACT DENSITY

Publication

EP 0121467 B1 19870805 (FR)

Application

EP 84400572 A 19840321

Priority

FR 8305062 A 19830328

Abstract (en)

[origin: US4684181A] A microconnector with a high density of contacts which make it possible to connect N parallel electrodes to N electrical conductors. The microconnector comprises a support able to receive the electrodes, N electrically conductive, flexible, elastic wires, respectively connected to the N conductors and fixed to an insulating part movable relative to said support in such a way that the wires are parallel and each of them can come into contact with a single electrode as a result of a displacement of the insulating part when the electrodes are fitted in the support. A cam is provided for moving the part in such a way as to bring about simultaneous contacts between the respective electrodes and wires. The microconnector can be used in connection with flat screen display means.

IPC 1-7

H01R 23/68; G04G 1/00

IPC 8 full level

G04G 17/00 (2013.01); H01R 12/88 (2011.01); H01R 13/22 (2006.01); H01R 33/76 (2006.01)

CPC (source: EP)

G04G 17/00 (2013.01); H01R 12/88 (2013.01)

Designated contracting state (EPC)

BE CH DE FR GB IT LI LU NL

DOCDB simple family (publication)

EP 0121467 A1 19841010; EP 0121467 B1 19870805; DE 3465226 D1 19870910; FR 2543746 A1 19841005; FR 2543746 B1 19851227; JP S59184473 A 19841019; US 4684181 A 19870804

DOCDB simple family (application)

EP 84400572 A 19840321; DE 3465226 T 19840321; FR 8305062 A 19830328; JP 5928684 A 19840327; US 80036285 A 19851121