EP 0122687 A2 19841024 - A semiconductor device comprising packing means for protecting parts of the device.
Title (en)
A semiconductor device comprising packing means for protecting parts of the device.
Title (de)
Halbleiteranordnung mit einer Packung zum Schützen von Teilen dieser Anordnung.
Title (fr)
Un dispositif semi-conducteur comprenant un empaquetage pour protéger des parties du dispositif.
Publication
Application
Priority
JP 4615383 A 19830318
Abstract (en)
A semiconductor device includes an electronic component in a hollow portion provided between two packing members each comprising a laminated structure. A laminated structure has a metallic layer and an insulating layer. The laminated structure can further have a reinforcing layer. One end surface of the laminated structure is an insulating layer. The insulating layers of these laminated structures are opposed to each other and the peripheral portions thereof are hermetically connected, so thatthe hollow portion containing the. electronic component is in an airtight state. A metallic layer is formed of a metal such as aluminum or an alloy thereof, an insulating layer is formed of organic material and the like and a reinforcing layer is formed of a fiber, a thermosetting resin, a thermoplastic resin and the like. The electronic component contained in the hollow portion is positioned so as not to be in contact with the packing members. The electronic component is electrically connected to the exterior through lead wires interposed between the surfaces of contact of the two packing members.
IPC 1-7
IPC 8 full level
H01L 23/06 (2006.01); H01L 21/56 (2006.01); H01L 23/02 (2006.01); H01L 23/057 (2006.01); H01L 23/08 (2006.01); H01L 23/14 (2006.01); H01L 23/20 (2006.01); H01L 23/26 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP US)
H01L 21/565 (2013.01 - EP US); H01L 23/057 (2013.01 - EP US); H01L 23/08 (2013.01 - EP US); H01L 23/145 (2013.01 - EP US); H01L 23/20 (2013.01 - EP US); H01L 23/26 (2013.01 - EP US); H01L 23/293 (2013.01 - EP US); H01L 23/315 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/45015 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01009 (2013.01 - EP US); H01L 2924/0101 (2013.01 - EP US); H01L 2924/01012 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01018 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/0103 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01051 (2013.01 - EP US); H01L 2924/01054 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01092 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/16152 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
US 4717948 A 19880105; DE 3475031 D1 19881208; EP 0122687 A2 19841024; EP 0122687 A3 19860115; EP 0122687 B1 19881102; JP H0315339 B2 19910228; JP S59172253 A 19840928
DOCDB simple family (application)
US 57688284 A 19840203; DE 3475031 T 19840127; EP 84300521 A 19840127; JP 4615383 A 19830318