EP 0123676 A4 19870219 - ELECTRONIC CIRCUIT CHIP CONNECTION ASSEMBLY AND METHOD.
Title (en)
ELECTRONIC CIRCUIT CHIP CONNECTION ASSEMBLY AND METHOD.
Title (de)
VERBINDUNGSZUSAMMENBAU UND VERFAHREN EINES CHIPS MIT EINEM ELEKTRONISCHEN SCHALTKREIS.
Title (fr)
ASSEMBLAGE ET PROCEDE DE CONNEXION D'UNE PUCE A CIRCUIT ELECTRONIQUE.
Publication
Application
Priority
US 8201584 W 19821109
Abstract (en)
[origin: WO8402051A1] The technical field of the invention concerns electronic circuit packaging and interconnecting an electronic circuit chip to a printed circuit board. Commonly, individual wires are attached to the chip pads and to the package pins manually, either by thermocompression or ultrasonic bonding. Such manual methods results in significant cost. The present invention provides a simpler and less costly assembly for and method of connecting an electronic circuit chip (30) to a printed circuit board (34). The assembly (20) includes a pressure connection frame (24) having an aperture (38) for receiving the electronic circuit chip (30), making electrical contact thereto, and also making electrical contact to electrically conductive traces (32) on the printed circuit board (34). The assembly (20) further includes a connection pressure pad (26) which contacts the pressure connection frame (24) about the aperture (38) into which is received the electronic circuit chip (30). The pressure connection frame (24), in which the electronic circuit chip (30) is received and to which the connection pressure pad (26) is secured, is inserted into a cover (22) which is then in turn secured to the printed circuit board (34) to complete the formation of the assembly (20) and the connection of the electronic circuit chip (30) to the printed circuit board (34).
IPC 1-7
IPC 8 full level
H05K 3/30 (2006.01); H01L 21/60 (2006.01); H05K 3/32 (2006.01); H05K 7/10 (2006.01)
CPC (source: EP)
H05K 7/1061 (2013.01); H01L 2924/0002 (2013.01)
Citation (search report)
- [Y] US 4169642 A 19791002 - MOUISSIE BOB [NL]
- [Y] US 4166665 A 19790904 - CUTCHAW JOHN M [US]
- [A] FR 2331891 A1 19770610 - TEKTRONIX INC [US]
Designated contracting state (EPC)
AT BE CH DE FR GB LI LU NL SE
DOCDB simple family (publication)
WO 8402051 A1 19840524; EP 0123676 A1 19841107; EP 0123676 A4 19870219; JP H0151056 B2 19891101; JP S59502003 A 19841129
DOCDB simple family (application)
US 8201584 W 19821109; EP 83900116 A 19821109; JP 50007482 A 19821109