EP 0127115 A2 19841205 - Heat sink structure for an electronic package.
Title (en)
Heat sink structure for an electronic package.
Title (de)
Wärmesenkstruktur für eine elektronische Packung.
Title (fr)
Structure d'un puits de chaleur pour un empaquetage électronique.
Publication
Application
Priority
US 49778183 A 19830525
Abstract (en)
A heat sink structure for mounting on a semiconductor package includes a plurality of pins (20) affixed to a lid on the package (12-16), and a cooling fin means (26) having a thin walled, cellular configuration with the cells defining parallel elongated openings that extend through the fin means. The pins (20) are seated in the cells of the fin means.
IPC 1-7
IPC 8 full level
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01)
CPC (source: EP US)
H01L 23/3677 (2013.01 - EP US); H01L 23/40 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0127115 A2 19841205; EP 0127115 A3 19861126; EP 0127115 B1 19881109; DE 3475142 D1 19881215; JP H0325022 B2 19910404; JP S59217345 A 19841207; US 4546405 A 19851008
DOCDB simple family (application)
EP 84105835 A 19840523; DE 3475142 T 19840523; JP 1459284 A 19840131; US 49778183 A 19830525