EP 0127794 A3 19851218 - METHOD OF MAKING PRINTED-CIRCUIT BOARDS
Title (en)
METHOD OF MAKING PRINTED-CIRCUIT BOARDS
Publication
Application
Priority
DE 3320183 A 19830603
Abstract (en)
[origin: EP0127794A2] The shortening of the manufacturing process of a printed circuit is achieved in that the varnish used as photoresist is not removed from the conductor paths after the etching process but is also used as a solder resist during the subsequent soldering process. <IMAGE>
IPC 1-7
IPC 8 full level
B23K 35/22 (2006.01); H05K 3/28 (2006.01); H05K 3/06 (2006.01); H05K 3/34 (2006.01); H05K 3/42 (2006.01)
CPC (source: EP)
B23K 35/224 (2013.01); H05K 3/28 (2013.01); H05K 3/064 (2013.01); H05K 3/3473 (2013.01); H05K 3/427 (2013.01); H05K 2203/0571 (2013.01); H05K 2203/0597 (2013.01)
Citation (search report)
- [X] EP 0063304 A2 19821027 - HOECHST AG [DE]
- [X] EP 0002040 A1 19790530 - CIBA GEIGY AG [CH]
- [A] EP 0075537 A1 19830330 - CIBA GEIGY AG [CH]
- [X] GALVANOTECHNIK, Band 72, Nr. 4, 1981, Saulgau, DE;H. KüNZIG "Photopolymeres Epoxidharz als Lötstop- und Isolierlack", Seiten 461-463
Designated contracting state (EPC)
CH DE FR GB IT LI NL
DOCDB simple family (publication)
EP 0127794 A2 19841212; EP 0127794 A3 19851218; DE 3320183 A1 19841206
DOCDB simple family (application)
EP 84105229 A 19840509; DE 3320183 A 19830603