Global Patent Index - EP 0150745 B1

EP 0150745 B1 19910306 - BINDER COMPOSITION FOR MOULDING

Title (en)

BINDER COMPOSITION FOR MOULDING

Publication

EP 0150745 B1 19910306 (DE)

Application

EP 85100275 A 19850112

Priority

DE 3403583 A 19840202

Abstract (en)

[origin: EP0150745A2] The binder composition for consolidating the moulding sand for foundry purposes consists of an alkali metal silicate, preferably sodium silicate, a polyhydric alcohol and further additives, modified carbohydrates, non-hygroscopic starch, a metal oxide and a filler being envisaged as additives.

IPC 1-7

B22C 1/02; B22C 1/18

IPC 8 full level

B22C 1/02 (2006.01); B22C 1/16 (2006.01); B22C 1/18 (2006.01)

CPC (source: EP)

B22C 1/167 (2013.01); B22C 1/188 (2013.01)

Designated contracting state (EPC)

AT BE CH FR GB IT LI LU NL SE

DOCDB simple family (publication)

EP 0150745 A2 19850807; EP 0150745 A3 19861126; EP 0150745 B1 19910306; AT E61258 T1 19910315; DD 233959 A5 19860319; DE 3403583 A1 19850808; DE 3403583 C2 19871217

DOCDB simple family (application)

EP 85100275 A 19850112; AT 85100275 T 19850112; DD 27297385 A 19850201; DE 3403583 A 19840202