EP 0152601 B1 19881207 - AQUEOUS ALCALINE BATH FOR CHEMICALLY PLATING COPPER OR NICKEL
Title (en)
AQUEOUS ALCALINE BATH FOR CHEMICALLY PLATING COPPER OR NICKEL
Publication
Application
Priority
DE 3404270 A 19840204
Abstract (en)
[origin: US4720404A] An aqueous alkaline bath is disclosed, for the adhesive chemical (electroless) deposition of copper, nickel, cobalt or their alloys with great purity, containing compounds of these metals, reducing agent, wetting agent, pH-regulating substance, stabilizer, inhibitor and complex former, characterized in that polyols and/or compounds of the biuret type are contained as complex former, as well as a method for the adhesive chemical deposition of the metals, employing this bath at a temperature from 5 DEG C. up to the boiling point of the bath, particularly for the manufacture of printed circuits.
IPC 1-7
IPC 8 full level
C23C 18/34 (2006.01); C23C 18/40 (2006.01)
CPC (source: EP US)
C23C 18/34 (2013.01 - EP US); C23C 18/40 (2013.01 - EP US)
Designated contracting state (EPC)
CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
EP 0152601 A1 19850828; EP 0152601 B1 19881207; AT 384829 B 19880111; AT A27385 A 19870615; CA 1254353 A 19890523; DE 3404270 A1 19850808; DE 3475535 D1 19890112; JP S60204885 A 19851016; US 4720404 A 19880119
DOCDB simple family (application)
EP 84115513 A 19841215; AT 27385 A 19850131; CA 473446 A 19850201; DE 3404270 A 19840204; DE 3475535 T 19841215; JP 1881585 A 19850204; US 89674186 A 19860807