EP 0155749 A2 19850925 - Cryoelectrodeposition.
Title (en)
Cryoelectrodeposition.
Title (de)
Kryo-Elektroplattieren.
Title (fr)
Déposition cryo-électrolytique.
Publication
Application
Priority
US 57282284 A 19840123
Abstract (en)
A process for electrodeposition of a material on a substrate that includes the steps of establishing a liquid halogenous electrolyte containing the material to be plated on the substrate and a solute, said electrolyte having an appropriate electrical conductance in a cryogenic environment; and establishing an electric field within the electrolyte to effect migration of ions of said material to the substrate where they deposit.
IPC 1-7
IPC 8 full level
C25D 3/02 (2006.01); C25D 3/00 (2006.01); C25D 3/54 (2006.01); C25D 3/66 (2006.01); C25D 5/00 (2006.01); C25D 9/08 (2006.01)
CPC (source: EP US)
C25D 3/665 (2013.01 - EP US); C25D 5/003 (2013.01 - EP US); C25D 5/007 (2020.08 - EP US); C25D 5/605 (2020.08 - EP US); C25D 21/02 (2013.01 - EP US); Y10T 428/12528 (2015.01 - EP US); Y10T 428/12646 (2015.01 - EP US); Y10T 428/12653 (2015.01 - EP US); Y10T 428/12674 (2015.01 - EP US); Y10T 428/12681 (2015.01 - EP US); Y10T 428/12708 (2015.01 - EP US); Y10T 428/12736 (2015.01 - EP US); Y10T 428/12757 (2015.01 - EP US); Y10T 428/12972 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI LU NL SE
DOCDB simple family (publication)
US 4517253 A 19850514; AT E76906 T1 19920615; DE 3586135 D1 19920709; DE 3586135 T2 19921203; EP 0155749 A2 19850925; EP 0155749 A3 19870826; EP 0155749 B1 19920603; JP H0633496 B2 19940502; JP S60169586 A 19850903
DOCDB simple family (application)
US 57282284 A 19840123; AT 85300371 T 19850121; DE 3586135 T 19850121; EP 85300371 A 19850121; JP 1069785 A 19850123