EP 0158890 A2 19851023 - Activating a substrate for electroless plating.
Title (en)
Activating a substrate for electroless plating.
Title (de)
Aktivierung eines Basismaterials vor der chemischen Metallisierung.
Title (fr)
Activation d'un substrat en vue d'une métallisation par voie chimique.
Publication
Application
Priority
US 59912084 A 19840411
Abstract (en)
A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a colloid of a precious metal and tin and then contacting the surface with a salt of ethylene diamine tetraacetic acid and/or of diethylene triamine pentaacetic acid.
IPC 1-7
IPC 8 full level
C23C 18/28 (2006.01); H05K 3/18 (2006.01)
CPC (source: EP)
C23C 18/28 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0158890 A2 19851023; EP 0158890 A3 19861008; JP S60218477 A 19851101
DOCDB simple family (application)
EP 85103734 A 19850329; JP 2666285 A 19850215