Global Patent Index - EP 0163904 B1

EP 0163904 B1 19890201 - ARGENTIFEROUS MATERIAL FOR WEAK CURRENT CONTACTS

Title (en)

ARGENTIFEROUS MATERIAL FOR WEAK CURRENT CONTACTS

Publication

EP 0163904 B1 19890201 (DE)

Application

EP 85104946 A 19850423

Priority

DE 3420231 A 19840530

Abstract (en)

[origin: EP0163904A2] 1. Silver-rich materials for light-duty contacts, in particular for plug-and-socket connections and sliding contacts, which are applied in a thin layer via a nickel intermediate layer to a substrate composed of a base-metal material, comprising 45 to 72 atom % of silver, 9 to 32 atom % of gold, 9 to 32 atom % of palladium, 0.01 to 1 atom % of iridium and/or osmium, 0 to 10 atom % of copper and/or 0 to 5 atom % of lead and/or 0 to 5 atom % of tin, characterized in that the contents of silver and gold are in an atomic ratio to each other, of 2:1, 3:1, 4:1, 5:1 or 6:1 and/or the contents of silver and palladium are in an atomic ratio to each other of 2:1, 3:1, 4:1, 5:1 or 6:1 and/or the contents of gold and palladium are in an atomic ratio to each other of 1:3, 1:2, 2:3, 1:1, 3:2, 2:1 or 3:1.

IPC 1-7

H01H 1/02

IPC 8 full level

C22C 5/06 (2006.01); H01H 1/02 (2006.01); H01R 13/03 (2006.01); H01R 39/20 (2006.01)

CPC (source: EP)

H01R 13/03 (2013.01)

Designated contracting state (EPC)

BE DE FR GB IT NL SE

DOCDB simple family (publication)

DE 3420231 C1 19850103; CA 1248366 A 19890110; DE 3568103 D1 19890309; EP 0163904 A2 19851211; EP 0163904 A3 19861230; EP 0163904 B1 19890201; JP S60257085 A 19851218

DOCDB simple family (application)

DE 3420231 A 19840530; CA 482697 A 19850529; DE 3568103 T 19850423; EP 85104946 A 19850423; JP 11333485 A 19850528