EP 0164294 B1 19890118 - ALUMINIUM BASE ALLOYS CONTAINING LITHIUM, COPPER AND MAGNESIUM
Title (en)
ALUMINIUM BASE ALLOYS CONTAINING LITHIUM, COPPER AND MAGNESIUM
Publication
Application
Priority
FR 8404482 A 19840315
Abstract (en)
[origin: US4752343A] The present invention relates to Al-base alloys essentially containing Li, Cu and Mg, and having high specific characteristics and a high degree of ductility. Their composition is as follows (% by weight): -Li 1.7 to 2.9 -Cu 1.5 to 3.4 - <IMAGE> -Mg 1.2 to 2.7 -Fe </= 0.20 -Si </= 0.06 -Cr 0 to 0.3 -Mn 0 to 1.0 -Zr 0 to 0.2 -Ti 0 to 0.1 -Be 0 to 0.01 -Other elements (impurities) -each </= 0.05 -total </= 0.15 -balance: Al - The heat treatment comprises a homogenization step at about theta ( DEG C.)=535-5 (% Mg) which practically dissolves the compounds Al-Cu (Li-Mg); a solution treatment at between theta +10 DEG C.; a quenching step; and a tempering step at from 170 DEG to 220 DEG C. for a period ranging from 8 to 48 hours. The mechanical strength and ductility characteristics obtained are equivalent to those of conventional alloys 2000 or 7000.
IPC 1-7
IPC 8 full level
C22C 21/00 (2006.01); C22C 21/06 (2006.01); C22C 21/16 (2006.01); C22F 1/00 (2006.01); C22F 1/04 (2006.01); C22F 1/057 (2006.01)
CPC (source: EP US)
C22C 21/16 (2013.01 - EP US)
Citation (examination)
ALUMINUM-LITHIUM ALLOYS II, PROCEEDINGS OF THE SECOND INTERNATIONAL ALUMINUM-LITHIUM CONFERENCE SPONSORED BY THE NONFERROUS METALS COMMITTE OF THE METALLURGICAL SOCIETY OF AIME, 12-14 april 1983, Monterey, California, W.S. MILLER et al.: "Development of lithium-containing aluminium alloys for the ingot metallurgy production route", p. 343. Alloy C9
Designated contracting state (EPC)
BE CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
US 4752343 A 19880621; BR 8501143 A 19851112; CA 1268643 A 19900508; DE 3567677 D1 19890223; EP 0164294 A1 19851211; EP 0164294 B1 19890118; ES 541146 A0 19860416; ES 8606516 A1 19860416; FR 2561261 A1 19850920; FR 2561261 B1 19920724; IL 74562 A0 19850630; IL 74562 A 19881115; JP H0440418 B2 19920702; JP S60215735 A 19851029; JP S63290252 A 19881128
DOCDB simple family (application)
US 71069185 A 19850311; BR 8501143 A 19850314; CA 476315 A 19850312; DE 3567677 T 19850313; EP 85420044 A 19850313; ES 541146 A 19850311; FR 8404482 A 19840315; IL 7456285 A 19850311; JP 10537688 A 19880427; JP 5154785 A 19850314