EP 0164580 A2 19851218 - Electroless copper plating bath and plating method using such bath.
Title (en)
Electroless copper plating bath and plating method using such bath.
Title (de)
Bad und Lösung zum stromlosen Verkupfern.
Title (fr)
Bain et procédé pour le cuivrage chimique.
Publication
Application
Priority
US 61127884 A 19840517
Abstract (en)
The electroless copper plating bath having improved stability contains a cationic polymer from acrylamide and/or methacrylamide. The plating bath also contains essentially a cupric ion source, a reducing agent for the cupric ion source, and a complexing agent for the cupric ion. A substrate to be plated is contacted with the plating bath maintained preferably at a temperature in the range between about 70 DEG C and about 80 DEG C.
IPC 1-7
IPC 8 full level
C23C 18/40 (2006.01)
CPC (source: EP)
C23C 18/40 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0164580 A2 19851218; EP 0164580 A3 19861230; EP 0164580 B1 19890920; DE 3573139 D1 19891026; JP H0214430 B2 19900409; JP S60245783 A 19851205
DOCDB simple family (application)
EP 85105723 A 19850510; DE 3573139 T 19850510; JP 340985 A 19850114