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EP 0164580 B1 19890920 - ELECTROLESS COPPER PLATING BATH AND PLATING METHOD USING SUCH BATH

Title (en)

ELECTROLESS COPPER PLATING BATH AND PLATING METHOD USING SUCH BATH

Publication

EP 0164580 B1 19890920 (EN)

Application

EP 85105723 A 19850510

Priority

US 61127884 A 19840517

Abstract (en)

[origin: EP0164580A2] The electroless copper plating bath having improved stability contains a cationic polymer from acrylamide and/or methacrylamide. The plating bath also contains essentially a cupric ion source, a reducing agent for the cupric ion source, and a complexing agent for the cupric ion. A substrate to be plated is contacted with the plating bath maintained preferably at a temperature in the range between about 70 DEG C and about 80 DEG C.

IPC 1-7

C23C 18/40

IPC 8 full level

C23C 18/40 (2006.01)

CPC (source: EP)

C23C 18/40 (2013.01)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0164580 A2 19851218; EP 0164580 A3 19861230; EP 0164580 B1 19890920; DE 3573139 D1 19891026; JP H0214430 B2 19900409; JP S60245783 A 19851205

DOCDB simple family (application)

EP 85105723 A 19850510; DE 3573139 T 19850510; JP 340985 A 19850114