EP 0168859 A1 19860122 - Heat dissipation device for an electrical component.
Title (en)
Heat dissipation device for an electrical component.
Title (de)
Wärmeabführeinrichtung für eine elektrische Komponente.
Title (fr)
Moyen de dissipation de la chaleur d'un composant électrique.
Publication
Application
Priority
NL 8401921 A 19840618
Abstract (en)
A heat dissipation device for an electrical component (1) provided with a heat conductor (23) arranged between the component (1) and a heat exchanger (29). The heat conductor 23 consists of a number of flexible bundles of heat-conducting cable cores (24), which are held in pressure contact by means of a pin (25) near their two ends with the wall of cylindrical holes (17) in a holder (3) for the component (1) and in the heat exchanger (29), respectively. The heat dissipation can be used both in single electrical components and in integrated circuits.
IPC 1-7
IPC 8 full level
H05K 7/20 (2006.01)
CPC (source: EP)
H05K 7/20445 (2013.01); H01L 2924/0002 (2013.01)
Citation (search report)
- [A] DE 2336878 A1 19750206 - SIEMENS AG
- [A] US 3129282 A 19640414 - FLYNN GORDON L
- [A] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 19, no. 5, Octobre 1976, page 1802, New York, US; O.J. CAIN et al.: "Semiconductor module with improved air cooling"
- [A] IBM TECHNICAL DISCOSURE BULLETIN, vol. 19, no. 7, December 1976, page 2652, New York, US; J.H. CIANCANELLI: "Circuit module iwth heat transfer"
Designated contracting state (EPC)
BE DE FR GB IT NL SE
DOCDB simple family (publication)
EP 0168859 A1 19860122; EP 0168859 B1 19890419; CA 1230427 A 19871215; DE 3569648 D1 19890524; JP S6112097 A 19860120; NL 8401921 A 19860116
DOCDB simple family (application)
EP 85200937 A 19850614; CA 483826 A 19850612; DE 3569648 T 19850614; JP 12917885 A 19850615; NL 8401921 A 19840618