Global Patent Index - EP 0176073 A2

EP 0176073 A2 19860402 - Method of bending plate materials.

Title (en)

Method of bending plate materials.

Title (de)

Verfahren zum Biegen von Plattenmaterial.

Title (fr)

Procédé pour cintrer du matériau à plaque.

Publication

EP 0176073 A2 19860402 (EN)

Application

EP 85112079 A 19850924

Priority

JP 20073984 A 19840926

Abstract (en)

Disclosed is a method of bending a plate material by means of an exclusive-use die shoe for the plate material to be worked and a versatile bending means having a pressing surface, wherein the edge portion of the die shoe (10) serves as a bending surface (11) for the plate material (5); the plate material (5) is mounted on and secured to the die shoe (10), bending means (15, 16, and 17; 18) are brought into contact with and pressed against a portion of the surface to be bent (13) of the plate material (5), moving the same along the surface to be bent, and bending the surface to be bent step by step. The bending means (15, 16, and 17) comprise a plurality of bending members, each bending member being formed in such a manner that the angle of each of the pressing surfaces (19, 20, and 21) thereof is formed such as to become gradually larger, and the bending members are used in sequence starting with the one having the pressing surface with the smallest angle. Or, the bending means (18) is a bending member having a pressing surface parallel to the axis of the bending member and is inclined against the plate material step by step.

IPC 1-7

B21D 5/08

IPC 8 full level

B21D 5/08 (2006.01)

CPC (source: EP)

B21D 5/08 (2013.01); B21D 5/083 (2013.01)

Designated contracting state (EPC)

DE FR GB IT NL SE

DOCDB simple family (publication)

EP 0176073 A2 19860402; EP 0176073 A3 19861203; JP S61159225 A 19860718

DOCDB simple family (application)

EP 85112079 A 19850924; JP 20073984 A 19840926