EP 0176475 A3 19880316 - COMPOSITIONS FOR POWDER COATING
Title (en)
COMPOSITIONS FOR POWDER COATING
Publication
Application
Priority
GB 8421525 A 19840824
Abstract (en)
[origin: US4757117A] Powder coating compositions suitable for use in the manufacture of laser-engraved printing rollers, comprise (a) a difunctional epoxy resin prepared from a bisphenol, (b) an epoxy resin having an epoxide functionality greater than 2, (c) a diaminodiphenylsulphone as hardener for the mixture of resins (a) and (b), and (d) an imidazole as curing accelerator. These compositions, when applied to a metal base member, fused, and cured, provide a surface that is easily engravable yet has excellent resistance to chemical attack and physical wear. Typical difunctional epoxy resins (a) are 2,2-bis(4-glycidyloxyphenyl)propane advanced with bisphenol A, while typical epoxy resins that may be used as (b) include polyglycidyl ethers of phenol-formaldehyde novolaks. The hardener (c) my be, for example, 3,3'- and 4,4'-diaminodiphenylsulphones and the imidazole accelerator (d) may be 2-methylimidazole or benzimidazole.
IPC 1-7
IPC 8 full level
B41D 7/00 (2006.01); B41N 1/12 (2006.01); C09D 5/03 (2006.01); C09D 5/46 (2006.01)
CPC (source: EP US)
B41C 1/05 (2013.01 - EP US); B41N 1/12 (2013.01 - EP US); Y10S 525/934 (2013.01 - EP US)
Citation (search report)
- [Y] EP 0094142 A1 19831116 - CROSFIELD ELECTRONICS LTD [GB]
- [Y] BE 707663 A 19680607 - DOW CHEMICAL CO [US]
- [Y] US 4331582 A 19820525 - BABAYAN EDUARD P
- [A] EP 0077758 A1 19830427 - CIBA GEIGY AG [CH]
- [A] GB 2055843 A 19810311 - CIBA GEIGY AG
- [Y] CHEMICAL ABSTRACTS, Band 85, Nr. 6, 9. August 1976, Seite 1, Zusammenfassung Nr.34011z, Columbus, Ohio, US; & JP-A-51 023 600 (FUJITSU LTD) 25-02-1976
Designated contracting state (EPC)
BE CH DE FR GB IT LI NL
DOCDB simple family (publication)
EP 0176475 A2 19860402; EP 0176475 A3 19880316; EP 0176475 B1 19910925; CA 1260190 A 19890926; DE 3584211 D1 19911031; GB 8421525 D0 19840926; JP S6164767 A 19860403; US 4757117 A 19880712
DOCDB simple family (application)
EP 85810379 A 19850819; CA 485029 A 19850625; DE 3584211 T 19850819; GB 8421525 A 19840824; JP 18651985 A 19850824; US 4069287 A 19870417