EP 0176555 B1 19881207 - MULTILAYER HYBRID INTEGRATED CIRCUIT
Title (en)
MULTILAYER HYBRID INTEGRATED CIRCUIT
Publication
Application
Priority
US 59762684 A 19840406
Abstract (en)
[origin: WO8504780A1] A multilayer circuit device comprises a substrate having a plurality of metallized patterns (e.g., 12, 18) thereon said patterns being separated by a photodefined polymeric dielectric film (14) formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias (16) through the polymeric film or film layers.
IPC 1-7
IPC 8 full level
G03F 7/027 (2006.01); H01L 23/538 (2006.01); H05K 1/00 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP US)
G03F 7/027 (2013.01 - EP US); H01L 23/5383 (2013.01 - EP US); H05K 3/4676 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 3/0023 (2013.01 - EP US); H05K 2201/0133 (2013.01 - EP US); H05K 2201/09509 (2013.01 - EP US); Y10S 428/901 (2013.01 - EP US); Y10S 430/121 (2013.01 - EP US)
Citation (examination)
- EP 0067231 A1 19821222 - SONY CORP [JP]
- US 3632861 A 19720104 - HARGIS SAMPSE R JR
Designated contracting state (EPC)
DE GB NL SE
DOCDB simple family (publication)
WO 8504780 A1 19851024; CA 1254789 A 19890530; DE 3566767 D1 19890112; EP 0176555 A1 19860409; EP 0176555 B1 19881207; JP H0447475 B2 19920804; JP S61501806 A 19860821; US 4554229 A 19851119
DOCDB simple family (application)
US 8500422 W 19850312; CA 477379 A 19850325; DE 3566767 T 19850312; EP 85901751 A 19850312; JP 50137385 A 19850312; US 59762684 A 19840406