EP 0179212 A2 19860430 - Chemical copper plating solution.
Title (en)
Chemical copper plating solution.
Title (de)
Stromlose Kupferplattierlösung.
Title (fr)
Bain de dépÔt chimique de cuivre.
Publication
Application
Priority
- JP 20044584 A 19840927
- JP 27330384 A 19841226
Abstract (en)
There is disclosed a chemical copper plating solution containing a copper salt, a complexing agent, a reducing agent and a pH adjustor which further comprises at least one of the following Groups (A) and (B); Group (A); at least one non-ionic surface active agent selected from the group consisting of a non-ionic surface active agent having the formula: <CHEM> (wherein m1 and n1 each represent an integer of 1 or more) and a non-ionic surface active agent having formula: <CHEM> (wherein m2 and n2 each represent an integer of 1 or more), and at least one compound selected from the group consisting of 1,10-phenanthroline, a 1,10-phenanthroline derivative, 2,2 min -dipyridyl, 2,2 min -biquinoline and a water-soluble cyan compound; Group (B); an organic sulfur compound and an ethyleneamine compound.
IPC 1-7
IPC 8 full level
C23C 18/40 (2006.01)
CPC (source: EP)
C23C 18/40 (2013.01)
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
EP 0179212 A2 19860430; EP 0179212 A3 19880127; EP 0179212 B1 19911227; DE 3585017 D1 19920206
DOCDB simple family (application)
EP 85109921 A 19850807; DE 3585017 T 19850807