Global Patent Index - EP 0179801 B1

EP 0179801 B1 19910123 - AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS

Title (en)

AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS

Publication

EP 0179801 B1 19910123 (EN)

Application

EP 85901779 A 19850319

Priority

US 59218584 A 19840322

Abstract (en)

[origin: WO8504517A1] A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.

IPC 1-7

H01L 21/60; H01L 23/495

IPC 8 full level

H01L 21/50 (2006.01); H01L 21/00 (2006.01); H01L 21/60 (2006.01); H05K 13/04 (2006.01)

CPC (source: EP KR US)

H01L 21/60 (2021.08 - KR); H01L 21/67126 (2013.01 - EP US); H01L 21/67144 (2013.01 - EP US); H05K 13/0478 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); Y10T 29/49128 (2015.01 - EP US)

Citation (examination)

Designated contracting state (EPC)

DE FR GB NL

DOCDB simple family (publication)

WO 8504517 A1 19851010; DE 3581480 D1 19910228; EP 0179801 A1 19860507; EP 0179801 A4 19870630; EP 0179801 B1 19910123; JP H0575176 B2 19931020; JP S61501536 A 19860724; KR 860700073 A 19860131; KR 940000741 B1 19940128; US 4627151 A 19861209

DOCDB simple family (application)

US 8500452 W 19850319; DE 3581480 T 19850319; EP 85901779 A 19850319; JP 50141785 A 19850319; KR 850700331 A 19851122; US 59218584 A 19840322