EP 0179802 A1 19860507 - INTEGRATED CIRCUITS WITH CONTACT PADS IN A STANDARD ARRAY.
Title (en)
INTEGRATED CIRCUITS WITH CONTACT PADS IN A STANDARD ARRAY.
Title (de)
INTEGRIERTE SCHALTUNGEN MIT ANSCHLUSSKONTAKTEN IN EINER STANDARDORDNUNG.
Title (fr)
CIRCUITS INTEGRES MUNIS DE PLOTS DE CONTACT DANS UN RESEAU STANDARD.
Publication
Application
Priority
US 59218684 A 19840322
Abstract (en)
[origin: WO8504518A1] An integrated circuit chip (310) includes a top layer of dielectric (320) penetrated by conductive vias (305) connecting electrical contacts (304) within the integrated circuit proper to a network of electrical leads (326) disposed on top of the dielectric layer (320); the network of leads (326), in turn, being connected to an array of contact pads (330) adapted for simultaneous solder connection to a leadframe.
Abstract (fr)
Une puce à circuits intégrés (310) comprend une couche supérieure de diélectrique (320) dans laquelle pénètrent des conducteurs (305) reliant les contacts électriques (304) dans le circuit intégré proprement dit à un réseau de conducteurs électriques (326) disposés au sommet de la couche diélectrique (320); le réseau de conducteurs (326) est relié à son tour à un réseau de plots de contact (330) adaptés à la connexion simultanée par soudage à un cadre conducteur.
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/485 (2006.01); H01L 25/16 (2006.01)
CPC (source: EP KR)
H01L 21/60 (2021.08 - KR); H01L 24/05 (2013.01 - EP); H01L 24/18 (2013.01 - EP); H01L 24/82 (2013.01 - EP); H01L 24/97 (2013.01 - EP); H01L 25/16 (2013.01 - EP); H01L 24/45 (2013.01 - EP); H01L 2223/5448 (2013.01 - EP); H01L 2224/0401 (2013.01 - EP); H01L 2224/05599 (2013.01 - EP); H01L 2224/16 (2013.01 - EP); H01L 2224/16227 (2013.01 - EP); H01L 2224/18 (2013.01 - EP); H01L 2224/45124 (2013.01 - EP); H01L 2224/45144 (2013.01 - EP); H01L 2224/97 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01009 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01014 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/01022 (2013.01 - EP); H01L 2924/01023 (2013.01 - EP); H01L 2924/01027 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/0103 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01039 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/0105 (2013.01 - EP); H01L 2924/01055 (2013.01 - EP); H01L 2924/01074 (2013.01 - EP); H01L 2924/01075 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/01322 (2013.01 - EP); H01L 2924/014 (2013.01 - EP); H01L 2924/10253 (2013.01 - EP); H01L 2924/13091 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/15787 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H01L 2924/19041 (2013.01 - EP); H01L 2924/19042 (2013.01 - EP); H01L 2924/19043 (2013.01 - EP); H01L 2924/30107 (2013.01 - EP); H01L 2924/3011 (2013.01 - EP)
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
WO 8504518 A1 19851010; EP 0179802 A1 19860507; EP 0179802 A4 19870601; JP H0554694 B2 19930813; JP H06318615 A 19941115; JP H0719792 B2 19950306; JP S61501538 A 19860724; KR 860700074 A 19860131; KR 960009090 B1 19960710
DOCDB simple family (application)
US 8500457 W 19850319; EP 85901784 A 19850319; JP 50141985 A 19850319; JP 6466093 A 19930301; KR 850700330 A 19851121