Title (en)

SURFACE GRINDING APPARATUS

Publication

EP 0180175 A3 19871014 (EN)

Application

EP 85113668 A 19851028

Priority

JP 22672084 A 19841030

Abstract (en)

[origin: EP0180175A2] A surface grinding apparatus for grinding the surface of a workpiece (W) such as a semiconductor wafer. The surface grinding apparatus comprises a support stand (4), at least one workpiece holding chuck table (6) rotatably mounted on the support stand (4), a rotatably mounted grinding wheel (8) for grinding the surface of the workpiece (W) held on the chuck table (6), chuck table rotating means (76) for rotating the chuck table (6) and wheel rotating means (116) for rotating the grinding wheel (8). When grinding the surface of the workpiece (W) held on the chuck table (6) with the grinding wheel (8), the grinding wheel (8) is rotated and the chuck table (6) is also rotated to rotate the workpiece (W) held on the chuck table (6).

IPC 1-7

B24B 7/16

IPC 8 full level

B24B 7/04 (2006.01); B24B 7/16 (2006.01)

CPC (source: EP KR)

B24B 7/04 (2013.01 - EP); B24B 7/16 (2013.01 - EP KR)

Citation (search report)

• [X] US 3691697 A 19720919 - BENDER DAVID L
• [XP] GB 2138719 A 19841031 - MARCONI ELECTRONIC DEVICES
• [X] US 2145310 A 19390131 - LEWIS ARTHUR J, et al
• [A] GB 1422908 A 19760128 - CONE BLANCHARD MACHINE CO
• [AD] EP 0039209 A1 19811104 - FUJITSU LTD [JP]
• [A] PATENT ABSTRACTS OF JAPAN, vol. 7, no. 237 (M-250)[1382], 21st October 1983; & JP - A - 58 126 051 (TOUKIYOU SEIKI KOUSAKUSHIYO) 27-07-1983

Designated contracting state (EPC)

DE FR GB IT NL

DOCDB simple family (publication)

EP 0180175 A2 19860507; EP 0180175 A3 19871014; JP S61109656 A 19860528; KR 860003081 A 19860519; KR 920003211 B1 19920424

DOCDB simple family (application)

EP 85113668 A 19851028; JP 22672084 A 19841030; KR 850008040 A 19851030