EP 0188386 A3 19861008 - GOLD ELECTROPLATING BATH
Title (en)
GOLD ELECTROPLATING BATH
Publication
Application
Priority
GB 8501245 A 19850118
Abstract (en)
[origin: EP0188386A2] An acid gold electroplating bath contains gold in an electrodepositable form, such as potassium gold cyanide, together with a metallic additive and an organic additive. The organic additive is a compound of the formula <CHEM> wherein X is -N= or -CR<3>=, and R<1>, R<2> and R<3> are each hydrogen, or an amino-, amido, thioamido- or cyano- group provided that one (and no more than one) of R<1>, R<2> and R<3> is not hydrogen. The metallic additive is preferably a cobalt, nickel or iron salt.
IPC 1-7
IPC 8 full level
C25D 3/48 (2006.01); C25D 3/56 (2006.01); C25D 3/62 (2006.01)
CPC (source: EP)
Citation (search report)
- [XP] EP 0150439 A1 19850807 - LEARONAL UK PLC [GB]
- [A] FR 2465798 A1 19810327 - ROHCO INC [US]
- [A] FR 2249979 A1 19750530 - DEGUSSA [DE]
- [A] DD 216260 A1 19841205 - ROBOTRON ELEKTRONIK [DD]
- [A] CHEMICAL ABSTRACTS, vol. 83, no. 22, 1st December 1975, page 414, abstract no. 185393k, Columbus, Ohio, US; Y. SHIMIZU et al.: "Effects of pyridine derivatives on the properties of electroplated nickel", & KINZOKU HYOMEN FIJUTSU 1975, 6(6), 258-63
- [A] GALVANOTECHNIK, vol. 64, no. 10, 1973, pages 905-910; A. KOLEV et al.: "Zur galvanischen Vergoldung"
Designated contracting state (EPC)
AT BE CH DE FR GB IT LI LU NL SE
DOCDB simple family (publication)
EP 0188386 A2 19860723; EP 0188386 A3 19861008; CN 86100895 A 19860716; DK 23686 A 19860719; DK 23686 D0 19860117; GB 8501245 D0 19850220; IE 860142 L 19860718; JP S61204391 A 19860910
DOCDB simple family (application)
EP 86300301 A 19860117; CN 86100895 A 19860117; DK 23686 A 19860117; GB 8501245 A 19850118; IE 14286 A 19860117; JP 659686 A 19860117