Title (en)

COPPER ALLOY AND PRODUCTION OF THE SAME

Publication

EP 0189637 B1 19881221 (EN)

Application

EP 85307331 A 19851014

Priority

• JP 22101584 A 19841020
• JP 24840084 A 19841124

Abstract (en)

[origin: EP0189637A1] There is provided a copper alloy which comprises 1.0 to 3.5 wt% of Ni, 0.2 to 0.9 wt% of Si, 0.02 to 1.0 wt% of Mn, 0.1 to 5.0 wt% Zn, 0.1 to 2.0 wt% of Sn, and 0.001 to 0.01 wt% of Mg, and 0.001 to 0.01 wt% of one or more members selected from Cr, Ti and Zr, with the remainder being substantially Cu. The copper alloy is suitable for lead frames for semiconductors and is also suitable for terminals and connectors. The copper alloy is produced by a process which comprises starting cooling from a temperature above 600°C at a rate of 5°C per second or higher after hot rolling of an ingot of said copper alloy, performing annealing at a temperature of 400 to 600°C for 5 minutes to 4 hours after cold working, performing refining finish rolling, and performing annealing at a temperature of 400 to 600°C for a short time of 5 to 60 seconds.

IPC 1-7

C22C 9/00; C22F 1/08; H01L 23/48; H01R 13/03

IPC 8 full level

C22C 9/06 (2006.01); C22F 1/08 (2006.01)

CPC (source: EP KR US)

C22C 9/06 (2013.01 - EP KR US); C22F 1/08 (2013.01 - EP US)

Designated contracting state (EPC)

CH DE FR GB LI

DOCDB simple family (publication)

EP 0189637 A1 19860806; EP 0189637 B1 19881221; DE 3566904 D1 19890126; HK 40292 A 19920612; KR 860003360 A 19860523; KR 900004109 B1 19900615; MY 100717 A 19910131; SG 21789 G 19890714; US 4656003 A 19870407

DOCDB simple family (application)

EP 85307331 A 19851014; DE 3566904 T 19851014; HK 40292 A 19920604; KR 850007699 A 19851018; MY PI19860154 A 19861128; SG 21789 A 19890408; US 78648285 A 19851011