EP 0197148 B1 19900613 - PRINTED-CIRCUIT BOARD FOR MOUNTING ELECTRONIC ELEMENT AND METHOD OF MANUFACTURE THEREOF
Title (en)
PRINTED-CIRCUIT BOARD FOR MOUNTING ELECTRONIC ELEMENT AND METHOD OF MANUFACTURE THEREOF
Publication
Application
Priority
JP 22523783 A 19831129
Abstract (en)
[origin: WO8502515A1] A printed-circuit board containing a plastic material is formed with an opening for mounting an electronic element, the opening extending through the board in the vertical direction. The opening thereof on the reverse side of the board is closed by a metal plate whose periphery is bonded to the board surface by a bonding layer. A deposited film is formed integrally over the inner wall and the bottom surface of the opening in the board, and a deposited film is formed integrally over the reverse surface of the board and the reverse surface of the metal plate. It is therefore possible to dissipate through the metal plate the heat generated from the electronic element mounted on the bottom surface in the opening. In addition, it is possible to prevent by the deposited films the intrusion of moisture which conventionally enters the opening in the board through the plastic material and the bonding layer.
IPC 1-7
IPC 8 full level
H05K 1/18 (2006.01); H01L 23/12 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01)
CPC (source: EP US)
H01L 23/13 (2013.01 - EP US); H01L 23/36 (2013.01 - EP US); H01L 23/49827 (2013.01 - EP US); H05K 1/0204 (2013.01 - EP US); H05K 1/021 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/15312 (2013.01 - EP US); H01L 2924/1532 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H05K 1/182 (2013.01 - EP US); H05K 2201/09845 (2013.01 - EP US); H05K 2201/09981 (2013.01 - EP US); H05K 2201/10416 (2013.01 - EP US); H05K 2203/049 (2013.01 - EP US); Y10S 428/901 (2013.01 - EP US); Y10T 156/1052 (2015.01 - EP US); Y10T 156/1064 (2015.01 - EP US); Y10T 428/239 (2015.01 - EP US); Y10T 428/24331 (2015.01 - EP US); Y10T 428/24917 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE FR GB LI LU NL SE
DOCDB simple family (publication)
EP 0197148 A1 19861015; EP 0197148 A4 19870629; EP 0197148 B1 19900613; DE 3482545 D1 19900719; FI 852798 A0 19850717; FI 852798 L 19850717; FI 86943 B 19920715; FI 86943 C 19921026; JP H0378795 B2 19911216; JP S60116191 A 19850622; SG 4191 G 19910405; US 4737395 A 19880412; US 4773955 A 19880927; WO 8502515 A1 19850606
DOCDB simple family (application)
EP 84904181 A 19841127; DE 3482545 T 19841127; FI 852798 A 19850717; JP 22523783 A 19831129; JP 8400565 W 19841127; SG 4191 A 19910128; US 5412287 A 19870514; US 75699085 A 19850712