EP 0198835 B1 19900228 - PRODUCTION OF COPPER-CLAD DIELECTRIC BOARDS
Title (en)
PRODUCTION OF COPPER-CLAD DIELECTRIC BOARDS
Publication
Application
Priority
GB 8333753 A 19831219
Abstract (en)
[origin: WO8502969A1] Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.
IPC 1-7
IPC 8 full level
B29C 70/06 (2006.01); B29C 43/20 (2006.01); B32B 7/02 (2006.01); B32B 9/00 (2006.01); B32B 15/08 (2006.01); B32B 37/00 (2006.01); B32B 37/10 (2006.01); B44C 1/14 (2006.01); B44C 1/16 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01); B29K 105/06 (2006.01); B29K 105/22 (2006.01); B29L 31/34 (2006.01)
CPC (source: EP US)
B32B 15/08 (2013.01 - EP US); B32B 15/18 (2013.01 - US); H05K 3/025 (2013.01 - EP US); H05K 3/384 (2013.01 - EP US); B32B 2307/408 (2013.01 - US); B32B 2311/12 (2013.01 - US); B32B 2311/18 (2013.01 - US); B32B 2311/30 (2013.01 - US); H05K 2201/0355 (2013.01 - EP US); H05K 2203/0152 (2013.01 - EP US); H05K 2203/0307 (2013.01 - EP US); H05K 2203/0723 (2013.01 - EP US); H05K 2203/0726 (2013.01 - EP US); H05K 2203/1121 (2013.01 - EP US); Y10S 428/901 (2013.01 - EP US); Y10S 428/935 (2013.01 - EP US); Y10T 29/49155 (2015.01 - EP US); Y10T 428/12569 (2015.01 - EP US); Y10T 428/12903 (2015.01 - EP US); Y10T 428/12924 (2015.01 - EP US); Y10T 428/12993 (2015.01 - EP US)
Citation (examination)
DE 3200593 A1 19820902 - GEN ELECTRIC [US]
Designated contracting state (EPC)
AT BE CH DE FR GB LI LU NL SE
DOCDB simple family (publication)
WO 8502969 A1 19850704; AT E50683 T1 19900315; AU 3789485 A 19850712; AU 572945 B2 19880519; DE 3481475 D1 19900405; EP 0198835 A1 19861029; EP 0198835 B1 19900228; GB 8333753 D0 19840125; JP H058091 B2 19930201; JP S61500840 A 19860501; KR 850700208 A 19851025; KR 920002968 B1 19920411; US 4715116 A 19871229; US 4781991 A 19881101
DOCDB simple family (application)
GB 8400441 W 19841219; AT 85900481 T 19841219; AU 3789485 A 19841219; DE 3481475 T 19841219; EP 85900481 A 19841219; GB 8333753 A 19831219; JP 50035185 A 19841219; KR 850700177 A 19850819; US 10704487 A 19871009; US 77029085 A 19851021